PRODUCTS / PCB/SMT/Photolithography / LPKF / PCB Rapid Prototyping
LPKF Plating through hole system
- Introduction
Reliable through-hole plating is key to the success of the challenging PCB prototyping process. The LPKF Contac S4 unites various galvanic and chemical processes in one compact safety housing.
The board is passed through six baths of a bath cascade. This yields reliable copper layers on the surfaces of all existing vias, even in multilayer boards.
The Contac S4 can process up to eight layers with a maximum aspect ratio of 1:10 (hole diameter to PCB thickness). It offers a subsequent tin bath step for surface protection and improved solderability
Advantages:
